The US Patent & Trademark Office published a patent application from Apple that relates to a new accessory device that, in addition to providing a protective cover for the electronic device, it provides a heat removal system to draw heat from one or more heat-generating components in the electronic device. At a first glance, the patent figures appeared to have a similar look as the iPhone 5c case. You’ll clearly see that the third layer and backside of the case is solid without holes. So there’s absolutely no connection to the former fruity 5c case design.

Accessory Device

Accessory devices are used to provide a protective cover for an electronic device. The accessory device generally covers the enclosure, or housing, and protects the electronic device in the event the electronic device is dropped. The thickness of an accessory device varies with the desired level of protection. For example, some accessory devices include a thickness of several millimeters and offer increased protection.

However, while the increased thickness may provide additional protection, it may also cause some drawbacks such as trapping heat which could cause problems. In some cases, heat could cause an iPhone (or other electronic device) to throttle down to reduce its performance in order to reduce the heat, which may then in turn reduce the overall performance of the iPhone.

The accessory device may retain the heat causing a hot spot in the accessory device. As a result, a user contacting the hot spot may experience a burn. Apple’s invention to combat this problem is to reinvent an iPhone’s casing by adding a new heat transfer mechanism on the face that accepts the backside of the iPhone.

Mechanism of heat transfer

The heat transfer mechanism may include a heat collector capable of receiving heat generated from the component. The heat transfer mechanism may further include a heat conduit thermally coupled with the heat collector. The heat conduit may provide a pre-defined heat path that limits a transfer of heat to a pre-defined portion of the wall.

Methods of forming accessory device

A method for forming an accessory device having a shell configured to secure an electronic device and aid in navigating heat away from a heat-generating component in the electronic device is described. The method may include disposing a thermally conductive layer in the shell in a first location that corresponds to a location of the heat-generating component when the electronic device is secured by the shell. The method may further include extending the thermally conductive layer from the first location to a second location different from the first location. The thermally conductive layer may define a path along which heat flows from the first location to the second location. In some embodiments, the second location corresponds to an opening that extends through the shell to allow any of the heat at the opening to dissipate away from the shell.

In some embodiments, in response to heat from the heat-generating component, the thermally conductive feature absorbs the heat from the electronic device by changing from a solid to a liquid.

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            US201700664869 A1

This patent relates to an accessory device for an electronic device. In particular, the following relates to an accessory device that, in addition to providing a protective cover for the electronic device, provides a heat removal system to draw heat from one or more heat-generating components in the electronic device.

  • Single piece case with a battery and a hinge- US 20170033580 A1

Accessory devices can be used as a protective cover for the electronic device as well as provide an aesthetic appearance.

Overcoming Issues

However increased thickness may provide additional protection, it may also cause some drawbacks such as trapping heat and which could cause problem. In some cases, heat could cause an iPhone to throttle down to reduce its performance in order to reduce the heat, which may then in turn reduce the heat, which may in turn reduce the overall performance of the phone. Apple’s invention to combat this problem is to reinvent an iPhone’s casing by adding a new heat transfer mechanism on the face that accepts the backside of the iPhone.

The heat transfer mechanism may include a heat collector capable of receiving heat generated from the component. The heat transfer mechanism may further include a heat conduit thermally coupled with the heat collector. The heat conduit may provide a pre-defined heat path that limits a transfer of heat to a pre-defined portion of the wall.